資通國際多年來提供電子業---EMI / RFI 電磁波輻射干擾之產業應用。
現在將有效之電磁波輻射干擾方案提供給民生處理---環境高溫與降溫節能應用。

歡迎經銷商 / 通路商 指導
Eco Materials Beat The Heat , The Heat Reduction Solution .
商品介紹

SMT EMI SHIELDING GASKET


CHARACTERISTICS
 
  • RoHS compliant
  • UL94V-0
  • Halogen Free
  • Available in SMT/Low surface resistance
  • Soldering compatible/Hardness can be adjusted
  • Smooth Surface of the alloy foil skin allows easy replacement by a pick & place equipment, and compatible for reflow tunnel efficient mass production using surface mounting equipment electrical conductivity is superior than existing fiber type of foam gasket and finger strip gasket.
  • Excellent resilience without bended or broken problem
  • Available in conductive cushioning material as adjusting varying hardness by custom made
USAGE


MERIT FOR OTHER ITEMS

PropertySMF GasketSMD type Finger GasketGound Foam gasket
Compression recovery rate High Low High
Surface resistance Low Low Middle
Gound Contact Part Face Dot/Line Face
Eco-friendly Halogen free Regulation of BeCu Halogen free


HOW TO ORDER


(1) Surface-Mounting Foam gasket
(2) Manufacturer's No. (Ex. 01,02,03...)
(3) Width (Ex. 040 : 4mm)
(4) Thickness (Ex. 035: 3.5mm)
(5) Length (Ex. 030 : 3mm)

STUCTURE AND SIZE LIST



RECOMMENDED DESIGE

(Unit:mm)
SMF SizePCB PatternSolder LandMetal Mask
Thickness
W L PW PL SW SG  
4.0 3.0 4.5 3.5 1.5 1.5 0.15
5.0 3.0 5.5 3.5 2.0 1.5 0.15
5.0 4.0 5.5 4.5 2.0 1.5 0.15
8.0 8.0 8.5 8.5 3.0 2.5 0.15

RE-FLOW-CONDITION



SPECIFICATION
PropertyunitValueTest Method
Resistance Bulk Ω < 0.1 ESQ-517-02
After SMT Ω < 0.1 Measure the resistance between gasket and pattern, after passing reflow
After aging test Ω < 0.1 ESQ-517-02
After salt water spray test Ω < 0.1  
After Thermal shock test Ω < 0.1 TST: Thermal Shock Test
Shielding effectiveness dB -70 (Avg.) MIL DTL-83528C modified
compression recovery rate Before aging % > 90 ESQ-517-26
After aging % > 90 ESQ-517-18
Repulsive power Kgf < 0.45 ESQ-517-27
Plating adhesion Grade 5 ESQ-517-16
Flame retardant   UL94V-0 UL94 test

REEL TAPE AND PACKING STANDARD

P/ND [mm]T [mm]Q'ty/reel
ABCDEFGHIJODIDRW
SMF□□-040025-030 4 2 1.5 8 12 5.5 1.75 4.3 0.3 2.8 330 13 12.4 2,500EA
SMF□□-040045-060 4 2 1.5 8 12 5.5 1.75 6.5 0.4 4.7 330 13 12.4 1,500EA
SMF□□-040030-040 4 2 1.5 8 16 7.5 1.75 5.5 0.4 3.5 330 13 17.5 2,500EA





GROUND FOAM GASKET




FABRIC TYPE

Characteristic
Superior shielding effectiveness & compression set

Specification
PropertyUnitMetric Value
Surface resistance Ω/□ < 0.1
Shielding effectiveness (at 100MHz~1GHz) dB > 65
Operating temperature -20 ~ +80
Recommended compression % 10~15
Flame class - UL94V-0(halogen free)※Only for FRtype
Enviromentally-friendly - RoHS Compliant

Shielding effectiveness

・Test standard : Advantest [MIL DTL-83528C equivalent]
・Sample size : 10mm(W) x 5mm(T), double sided PSA(T222)
・Surface material : conductive fabric (Polyester + Cu, Ni)

Compression-deflection-resistance test

・Test standard : ESQ-517-27 (referred to various test method)
・Sample : SF100100R-M-NC-A
・Sample size : 10mm(W) x 10mm(T) x 50mm(L)
・Recommended compression : Approx. 30%

Processing into other various shapes and dimension are possible



Electricity is conducted through the outer conductive layer of the gasket from A to B. Use of conductive PSA increases the electrical contact area between the gasket's outer layer and B at a slight sacrefice of PSA's adhesive strenth and cost over non- conductive PSA. When the width of the gasket is narrow, conductive PSA is required.

Gasket Structure Guidelines
Required conditionCladdingCore: PU foam
[hardness(ILD25%):45Kg/314㎤]
PSA width vs. (Gasket width) [%]
Double sided conductive PSADouble sided non-conductive PSA
High shielding effectiveness with strong adhesion AU plated type PU foam 30 -
Primarily shielding effectiveness Cu,Ni plated type PU foam 50 -
Primarily adhesion strength Cu,Ni plated type PU foam 30 50
High pressure Cu,Ni plated type PU foam (specified hardness)
(ex: 70Kg/314㎤)
- 30
Low price Al foil PU foam - 30
Please note that above chart is just recommendation, so user make a decision according to application & condition


the fabric over foam is grounding between inner communication equipment case and I/O connector of PCB


the fabric over foam is grounding between inner frame (or tuner) and outer chassis


the fabric over foam is grounding between outer case of cell phone and inner conductive coating