資通國際應材有限公司

Micro-wave Absorber(吸波材)-A4 Size

Sun, 24 Jan 2016 23:43:10 +0800

Micro-waveAbsorber-EMI吸波材CHARACTERISTICItispossibletomanageinthemicrowaveband(13GHz)Accordingtocontrolimpedance,controlresonanceofunnecessarymicrowaveAvailableforslimtypeofdevicetoultrathinthicknessEasytoattachonanysurfaceswithsinglesideadhesiveevenroundedsideDiecutavailableThisproductismadewithmetalmagneticpowder.Throughthedistributedandmixedprocess,thereisaMicrowaveabsorbingsheetmadeofrubbersheets.Asincreasinguseofwidefrequencyband,thisproductsabsorbandcontrolunnecessaryelectronicmicrowaves(noise).☞EMIshieldingtypeShapeSheetRollSheetPartNo.SRA45SRA46SRA47SRA48SRA31SRA35SRA34SRA331SRA70RSRA611SRA601LayerSinglelayerFrequencyrange10MHz~6GHzPermeability[μ'@3㎒]257080100130160190210120100130Thickness[㎛]30~30030~20030~300Temperature[℃]-30~85Density[g/cm3]3.63.73.82.53.3Thermalconductivity[W/mK]0.50.10.5Hardness[ShoreA]908095Tensilestrength[kgf/mm2]2423Elongation[%]852Surfaceresistivity[Ω/□]>1x106Echo-friendlyRoHS,HalogenfreeULgradeUL94V0SizeStd.210mmx300mm300mmx20M210mmx300mmMax.350mmx600mm350mmx100M350mmx600M☞NFC/RFIDtypeShapeSheetRollPartNo.STA11STA12STA80RLayerSinglelayerFrequencyrange10MHz~6GHzPermeabilityμ’@13.56MHz556045μ”@13.56MHz<2<1Thickness[㎛]30~30030~200Temperature[℃]-30~85Density[g/cm3]3.92.8Thermalconductivity[W/mK]0.50.1Hardness[ShoreA]9080Tensilestrength[kgf/mm2]42Elongation[%]58Surfaceresistivity[Ω/□]1x106Echo-friendlyRoHS,HalogenfreeULgradeUL94V0SizeStd.210mmx300mm300mmx20MMax.350mmx600mm300mmx100M30um超薄-RFI 磁場屏蔽材Productinformation面積210±5mmX300±5mm總厚度0.25±0.05mm適用頻率300KHz~1.5GHz屏蔽效果≧-60db MainapplicationEMI應用.吸波導波屏蔽Technicaldata比重:3.9(g/cm3)熱導性:1.9(W/m．k)操作溫度:-25℃~+85℃危害物質:符合(CE/2012/B5091B)無鹵(CE/2012/B5091B)布重:29g/m2±10%表面阻抗:0.03~0.05Ω/sq垂直阻抗:0.01~0.03ΩIsolationFilm拉力9.5伸長率100%介電常數DC5KVAC3KV體積電阻1*1015Ω/cm耐熱溫度130℃StructureShieldingEffectionS21穿透損耗(InsertionLoss)300KHz~10GHz

SRI冷屋頂隔熱節能塗料

Tue, 06 Jun 2017 14:47:55 +0800

台灣首推SRI冷屋頂隔熱塗料-熱逸膏與歐美LEED綠建築隔熱規範同步接軌什麼是SRI冷屋頂(CoolRoof)美國LEED冷屋頂性能評估協會規範，綠建築評估指標-第7.2項規定，建築其設計屋頂總面積之75%，必須採用日光反射係數(SolarReflectiveIndex,SRI值)SRI值必須大於83以上之材料，才能得分!資料來源:CoolRoofRatingCouncil(CRRC)EuropeanCoolRoofsCouncil(ECRC)冷屋頂有什麼好處一.對於業主1.減少建築物內部冷氣空調所需要的能量。2.減少屋頂上的熱應力，可提高空調與建物系統的壽命。3.改善室內舒適性。4.降低運營和維護成本。二.對於政策制定者1.減少對室內冷卻和相關的溫室氣體排放量所需要的能源。2.對全球環境產生積極正面影響。3.有利於緩解城市熱島效應。歸納SRI冷屋頂好處 1.反射太陽輻射熱 88.1% 2.熱逸散建築物熱能 88% 3.隔熱降溫冷屋頂 4.冷房速度快迅速涼爽舒適 5.節能省電可達45% 6.購買成本可從省電回收 7.減少碳排放愛地球

GROUND FOAM GASKET

Wed, 16 Mar 2016 10:29:33 +0800

GROUNDFOAMGASKETThegasketconsistsofconductivefabric,metalfoiloverfoamforgoodshieldingeffectivenesswithlowsurfaceresistance,Usedforgroundingandshielding.Itiseasytoattachwithpressuresensitiveadhesiveandeasytocuttoanylengthfortrouble-freeinstallation.Customshapesareavailabletomeetcustomerneeds.Application:LCDTV,Smartphone,Smartpad,mobiledevice,militaryequipmentandetc.(Equipmentforrequiredperformance)UsageGuideSpecificationPropertyUnitMetricValueSurfaceresistanceΩ/□<0.1Shieldingeffectiveness(at100MHz~1GHz)dB>65Operatingtemperature℃-20~+80Recommendedcompression%10~15Flameclass-UL94V-0(halogenfree)※OnlyforFRtypeEnviromentally-friendly-RoHSCompliant・Teststandard:Advantest[MILDTL-83528Cequivalent]・Samplesize:10mm(W)x5mm(T),doublesidedPSA(T222)・Surfacematerial:conductivefabric(Polyester+Cu,Ni)・Teststandard:ESQ-517-27(referredtovarioustestmethod)・Sample:SF100100R-M-NC-A・Samplesize:10mm(W)x10mm(T)x50mm(L)・Recommendedcompression:Approx.30%

CONDUCTIVE TAPE 導電布

Sun, 24 Jan 2016 22:51:59 +0800

CONDUCTIVETAPECHARATERISTICRoHScompliantUL510HalogenFree/OutstandingConductivityExcellentAdhesivePowerAscoatedconductivePSAinconductivefabric,metalfoilwhatsoon,itisroleforadhesive&electronicconductivity.Goodforflexibility(fabrictype)ThereissinglePSAtypeanddoublePSAtypeandanytypecanbeprocessedwithThompsonorhalfcuttingprocessing.-Ultrathinthickness(material:0.03mm)-Goodadhesiveness-Excellentconductivity-Suitableforslimelectronicproducts-USAGESmartphone,smartpad,gameconsoleetc.AttachedbetweenshieldcanandmoduleofcameraAttachedonthecase. Conductivefabrictape-SpecificationPartNoBaseMaterialColorThickness[mm]Adhesivestrength[gf/25mm]ASTMD3330Surfaceresistance[Ω/□]MIL-DTL-83528CFlameretardantT3186Cu/NiplatedPETripstopwovenGray0.11±0.01>1100<0.10UL510(halogenfree)No.E253699T3185Cu/NiplatedPETripstopwovenGray0.11±0.01>1100<0.10UL510(halogenfree)No.E253699T3181Cu/NiplatedPETripstopwovenGray0.11±0.01>900<0.10UL510(Dioxindetected)No.E253699T214Cu/NiplatedPETtaffetawovenGray0.11±0.01>700<0.10UL510(Dioxindetected)No.E253699T2142Cu/NiplatedPETtaffetawovenGray0.10±0.01>1000<0.10-T1216Cu/NiplatedPETripstopwovenGray0.05±0.01>1000<0.10-T1256Cu/NiplatedPETtaffetawovenGray0.07±0.01>1000<0.10-T233Cu/NiplatedPETtaffetawovenGray0.145±0.015>1000<0.10-T200Cu/NiplatedPETripstopwovenGray0.11±0.01>1000<0.10-T217Cu/NiplatedPETripstopwovenGray0.11±0.01>900<0.10-T221Cu/NiplatedPETtaffetawovenGray0.11±0.01>800<0.10-T2301Cu/NiplatedPETtaffetawovenBlack0.11±0.01>1000<0.10-※Standardsize Width:25mm,50mm(min5mm) Length:25M,50M-SpecificationPartNoBaseMaterialColorThickness[mm]Adhesivestrength[gf/25mm]ASTMD3330Verticalresistance[Ω/□]MIL-DTL-83528CFlameretardantT276CopperfoilGray0.07±0.01>1000<0.50-T2801 AluminiumfoilGray0.07±0.01>1100<0.50-T262EmbossedcopperfoilGray0.095±0.01>800<0.50-T283EmbossedaluminiumfoilGray0.095±0.01>800<0.50-T3081PETfilmlaminatedaluminiumfoilGray0.07±0.01>1000<0.50-※Standardsize Width:25mm,50mm(min1.5mm) Length:25M,50M

HanCool 離子漆

Tue, 13 Aug 2019 23:15:49 +0800

SMT EMI SHIELDING GASKET

Wed, 16 Mar 2016 10:26:36 +0800

CHARACTERISTICS RoHScompliantUL94V-0HalogenFreeAvailableinSMT/LowsurfaceresistanceSolderingcompatible/HardnesscanbeadjustedSmoothSurfaceofthealloyfoilskinallowseasyreplacementbyapick&placeequipment,andcompatibleforreflowtunnelefficientmassproductionusingsurfacemountingequipmentelectricalconductivityissuperiorthanexistingfibertypeoffoamgasketandfingerstripgasket.ExcellentresiliencewithoutbendedorbrokenproblemAvailableinconductivecushioningmaterialasadjustingvaryinghardnessbycustommadeUSAGEMERITFOROTHERITEMSPropertySMFGasketSMDtypeFingerGasketGoundFoamgasketCompressionrecoveryrateHighLowHighSurfaceresistanceLowLowMiddleGoundContactPartFaceDot/LineFaceEco-friendlyHalogenfreeRegulationofBeCuHalogenfreeHOWTOORDER(1)Surface-MountingFoamgasket(2)Manufacturer'sNo.(Ex.01,02,03...)(3)Width(Ex.040:4mm)(4)Thickness(Ex.035:3.5mm)(5)Length(Ex.030:3mm)STUCTUREANDSIZELISTRECOMMENDEDDESIGE(Unit:mm)SMFSizePCBPatternSolderLandMetalMaskThicknessWLPWPLSWSG 4.03.04.53.51.51.50.155.03.05.53.52.01.50.155.04.05.54.52.01.50.158.08.08.58.53.02.50.15RE-FLOW-CONDITIONSPECIFICATIONPropertyunitValueTestMethodResistanceBulkΩ<0.1ESQ-517-02AfterSMTΩ<0.1Measuretheresistancebetweengasketandpattern,afterpassingreflowAfteragingtestΩ<0.1ESQ-517-02AftersaltwaterspraytestΩ<0.1 AfterThermalshocktestΩ<0.1TST:ThermalShockTestShieldingeffectivenessdB-70(Avg.)MILDTL-83528CmodifiedcompressionrecoveryrateBeforeaging%>90ESQ-517-26Afteraging%>90ESQ-517-18RepulsivepowerKgf<0.45ESQ-517-27PlatingadhesionGrade5ESQ-517-16Flameretardant UL94V-0UL94testREELTAPEANDPACKINGSTANDARDP/ND[mm]T[mm]Q'ty/reelABCDEFGHIJODIDRWSMF□□-040025-030421.58125.51.754.30.32.83301312.42,500EASMF□□-040045-060421.58125.51.756.50.44.73301312.41,500EASMF□□-040030-040421.58167.51.755.50.43.53301317.52,500EA

GROUND FOAM GASKET

Wed, 16 Mar 2016 10:39:10 +0800

FABRICTYPECharacteristicSuperiorshieldingeffectiveness&compressionsetSpecificationPropertyUnitMetricValueSurfaceresistanceΩ/□<0.1Shieldingeffectiveness(at100MHz~1GHz)dB>65Operatingtemperature℃-20~+80Recommendedcompression%10~15Flameclass-UL94V-0(halogenfree)※OnlyforFRtypeEnviromentally-friendly-RoHSCompliantShieldingeffectiveness・Teststandard:Advantest[MILDTL-83528Cequivalent]・Samplesize:10mm(W)x5mm(T),doublesidedPSA(T222)・Surfacematerial:conductivefabric(Polyester+Cu,Ni)Compression-deflection-resistancetest・Teststandard:ESQ-517-27(referredtovarioustestmethod)・Sample:SF100100R-M-NC-A・Samplesize:10mm(W)x10mm(T)x50mm(L)・Recommendedcompression:Approx.30%ProcessingintoothervariousshapesanddimensionarepossibleElectricityisconductedthroughtheouterconductivelayerofthegasketfromAtoB.UseofconductivePSAincreasestheelectricalcontactareabetweenthegasket'souterlayerandBataslightsacreficeofPSA'sadhesivestrenthandcostovernon-conductivePSA.Whenthewidthofthegasketisnarrow,conductivePSAisrequired.GasketStructureGuidelinesRequiredconditionCladdingCore:PUfoam[hardness(ILD25%):45Kg/314㎤]PSAwidthvs.(Gasketwidth)[%]DoublesidedconductivePSADoublesidednon-conductivePSAHighshieldingeffectivenesswithstrongadhesionAUplatedtypePUfoam30-PrimarilyshieldingeffectivenessCu,NiplatedtypePUfoam50-PrimarilyadhesionstrengthCu,NiplatedtypePUfoam3050HighpressureCu,NiplatedtypePUfoam(specifiedhardness)(ex:70Kg/314㎤)-30LowpriceAlfoilPUfoam-30Pleasenotethatabovechartisjustrecommendation,sousermakeadecisionaccordingtoapplication&conditionthefabricoverfoamisgroundingbetweeninnercommunicationequipmentcaseandI/OconnectorofPCBthefabricoverfoamisgroundingbetweeninnerframe(ortuner)andouterchassisthefabricoverfoamisgroundingbetweenoutercaseofcellphoneandinnerconductivecoating

CONDUCTIVE THERMAL TAPE 散熱導電布

Wed, 16 Mar 2016 10:54:36 +0800

CHARACTERISTICExcellentAdhesivePowerOutstandingConductivityThermosetplasticsonconductivefabrics./li>Duringheating,Itwilloccurviscosity.Excellentforconductivity.Usage:unnecessaryforadhesivenessSmallsurface

PER EACH PART

Thu, 17 Mar 2016 20:33:48 +0800

one-touchMethod PossibletoinstalleasilythetentwithOne-Touchmethod)FrameConnectionInthecouplingrods,usercanputAluminumpipesandassembleeasilywithaphilipsscrewdriver.DoorsandHandlesEasytoopenorclosedoorswithaconductivefastenerandmiddleholder.1.DoorsandHandles 2.Fastener–Endingpoint 3.FastenerReplacementIffastenerisbrokenduetolong-termuse,usercanremovevelcrosinbothsize.Power-tubeConnectionPowerandsignallinepathStandardsize:φ100mmXL1000mmSuppressEMIinflewofthetentToincreaseshieldingeffectiveness,EMIfilterboxcanbeusedforsupplyingsignalandpower.Power-tube/EMIfilterboxConnectionPowerandsignallinepathStandardsize:φ100mmXL1000mmSuppressEMIinflewofthetentToincreaseshieldingeffectiveness,EMIfilterboxcanbeusedforsupplyingsignalandpower.InsideofAir-Filinghole/honeycombAir-FilingholetosupplyairintoinsideofthetentSizeofAir-Filinghole:Ø50㎜x300㎜(L)Air-blowerspecification(recommend):ex)Iftentsizeis1500X1500X2000(㎜),theair-blowerofairvolume300㎥/hissuitable.Air-blowerConnectionConductivemeshlayerisplacedbetweenTransparentPlastictubessoelectromagneticwavesareblockedandinsidemonitoringisavailable.SizeofAir-Filinghole:Ø50㎜x300㎜(L)Air-blowerspecification(recommend):ex)Iftentsizeis1500X1500X2000(㎜),theair-blowerofairvolume300㎥/hissuitable.ShieldingMonitorWindowConductivemeshlayerisplacedbetweenTransparentPlastictubessoelectromagneticwavesareblockedandinsidemonitoringisavailable.Materialofconductivemeshlayer:platingfabricsorstainlesssteelIfconductivemeshconsistsofdual-layers,shieldingeffectivenessisimprovedmore.Air-blowerWindowItputouttheairinsideofthetent.Itconsistsofconductivemeshorhoneycombso electromagneticwavesareblockedandairispassthroughtheair-blowerwindow.)

Table Type Shielded Tent

Wed, 16 Mar 2016 12:07:14 +0800

CHARACTERICTICItispossibletoinstallonthetable,sosuitablefortesttosmallinstrumentItissoinexpensiveandpossibletoinstall/uninstallinashorttime.SizeP/NWidth[mm]Length[mm]Height[mm]ST-0505-####-@-1500500500ST-0606-####-@-1600600600ST-0707-####-@-1700700700ST-0808-####-@-1800800800ST-0909-####-@-1900900900ST-1010-####-@-11,0001,0001,000※Thesesizesarebasedontentcovers.Framesarelargerthantentsizes(about50mm)ShieldingEffectivenessSingnal900MHz2.4GHz5.9GHzShieldingeffectiveness[㏈]614741※Size:500x500x500[mm]※TestMethod:selftestbyIESS-STD-299

SHIELDED POUCH

Wed, 16 Mar 2016 12:03:43 +0800

CHARACTERICTICItissuitabletosimplyshieldfornotebook,mobilephone,circuitandsoonItispossibletoanyformfrominputtingboxorsmallframeItispossibletoseethroughinsidetentincaseofmeshfabricofshieldedcoverSizeShieldcoverUsage500seriesConductiveMeshNotebookComputer,SmallBox(300X300X300㎜),MobilePhone,PDA,ElectronicOrganizer700seriesConductiveMeshShieldingEffectiveness Signal900MHz2.4GHz5.9GHzShieldingeffectiveness[dB]500series-36-30-30700series-24-20-21※Size:300x300x300[mm]※TestMethod:IESS-STD-299ShieldingEffectiveness

OPTION PART SPECIFICATIONS

Wed, 16 Mar 2016 12:03:40 +0800

EMIfilterbox/airvent/LEDlight/shieldedglove/shieldedwindowEMIFilterBoxCONNECTOR :ACpowersupply,DCpowersupply,LAN,USB2.0,SMA,BNC-N,RJ45,9pin,15pin,D-SUB,etc.–It'savailabletoproduceascustomer'srequest.Shieldingeffectiveness :-40~-60㏈/300㎒~1㎓HoneycombMaterial :Aluminum0.06㎜(T)CellSize:12.7mm(T),Cellsize:3.2mmOutersizeofair-blower:Ø120㎜Outersizeofventilatingwindow :200x300㎜LEDlightLEDlight(ropetype) :3W/1m.DCpower-supply24V/110∼220VColor :whiteRef :Incaseoftentof1.5X1.5X2(m),2mlengthofLEDlightissuitable.ShieldedGlovesMaterial :Conductivepolyesterfabric(Surface:Ni+Cu+Ni+Urethanecoating)Shieldingeffectiveness :-70㏈/100㎒~1㎓[ASTMD4935]ShieldedWindowHighshieldingtype/Samplesize340x240x3(T)㎜※Structure&materialOrdinarytype(ConductiveMesh–Singlelayer)Highshieldingtype(ConductiveMesh–Doublelayer)-Material :Conductiveblackmeshfabric(130mesh),Polycarbonateboard-Size :200x300x2(T)mm-Shieldingeffectiveness :-40dB/100MHz~1GHz-Penetrationratio :60%-Material :Conductiveblackmeshfabric(130mesh),polycarbonateboard-Size :200x300x3(T)mm-Shieldingeffectiveness :-60dB/100MHz~1GHz-Penetrationratio :40%StandardMaterialSpecificationsMaterialSpecificationTentMaterialPolyesterConductiveFabricdual-layers(Platedlayer:Ni/Cu/Ni)Thickness0.18mmSurfaceresistance0.05/Ω•㎝(TeststandardMIL-DTL-83528C)Heatresistance15℃∼+100℃FrameMaterialAluminumPipe(No.6063)SizeOD.30㎜T2㎜(Room-type)OD.25㎜T2㎜(Table-type)FrameconnectionsocketMaterialAlcasting,thickness5mmDoorfastenerMaterialBrass/Size-type10MeshFabricMaterialPolyesterConductiveFabriclayer(Platedlayer:Ni/Cu/Ni)Thickness0.07㎜.200mesh/inch2Surfaceresistance0.09/Ω·㎝(testmethodMIL-DTL-83528C)Heatresistance-15℃∼+100℃Ventilatingwindow(Mashtype)Size300x200x3(T)㎜Shieldingeffectiveness-80㏈/20㎒-1㎓(ASTMD4935)StructureAluminiumboardAluminium foilMaterialA1235Thickness0.1mmPlasticboxPlasticboardThickness5mmStructure

Shielded tent

Mon, 25 Jul 2016 22:23:09 +0800

電磁波屏蔽帳篷 (可拆移動式隔離室)Theengineercantesttheinsideoftent becauseitiswellventilatedandpossibletosetuplightItissuitableforoperatinginlargeinstrumentorinsideifshieldingspacePortable“shieldedroom” Double-layerdconductivefabricanddouble-doorsystemachieveshighshieldingeffectiveness"Userscanpackatentandflamesinthebackandmoveiteasily"RoomtypeshieldedtentCHARACTERICTICTheworkercantesttheinsideoftentbecauseitiswellventilatedandpossibletosetuplightItissuitableforoperatinginlargeinstrumentorinsideifshieldingspaceSizeP/NWidth[mm]Length[mm]Height[mm]ST-1515-####-@-11,5001,5002,000ST-1520-####-@-11,5002,0002,000ST-1530-####-@-11,5003,0002,000ST-2020-####-@-12,0002,0002,000ST-2030-####-@-12,0003,0002,000ST-3030-####-@-13,0003,0002,000ST-2448-####-@-12,4004,8002,000※Thesesizesarebasedontentcovers.Framesarelargerthantentsizes(about100mm)ShieldingEffectivenessPerSignalsandComponentsField(㎒)(㏈)doorAirVentFilterBoxWallElectricfield185.085.485.088.8Planewave40071.876.878.783.41,00069.267.271.973.62,50063.864.972.765.25,00058.863.961.859.710,00060.762.160.548.6※Size:1500x1500x2000(㎜)※TestMethod:basedonIEEE-STD-299 最大尺寸:2,400*4,800*2,000mmattenuationof-86.7dBoverarangeoffrequenciesfrom400MHzto18GHz

THERMAL FOAM GASKET (TFG)

Fri, 27 May 2016 00:16:55 +0800

FeaturesUsingagraphitesheethasexcellenthorizontalthermalconductivity,itdropstheheatofheatsourcebyspreadingtheheatquicklyfromtheheatsource.Graphite-particledoesnotoccurbycoatingallsurfacesofgraphitewithathinfilm.Awideutilizationwithoutthicknessofconstraintthatisthedisadvantageofsiliconethermalpad.-Example(in10mm,20mm,30mmormorethickness,thermalperformanceshows)Theexcellentcompressionresiliencebyusingtheheatpolyurethanesponge.Noproblemwithbendingofthecircuitboardduetotheexcellentelasticpolyurethanespongecore.Easytomanufacturegasketsofvarioussizes.Becauseitdoesnotneedaspecialmold,itispossibletoproducegoodsofanysizeyouwantpromptly.Accordingtotheneedsofusers,thermalconductivityandcompressivestrengthcanbeadjustedsimply.HoldanumberofpatentsWecanguaranteethequalityandpatentsofGraphitesheetusedinproductsbycontractingwithE-GrafTechInc.ConceptandPurposeTFGdelivertheheatofheatsourcetotheheatsinkormetalframe.Itusestodropthetemperatureofcircuitsbydispersingtheheatofheatsourcewidely. »Overallheightof10to15%isappropriateforpressureconditionsofTFG.»ApplicationEquipments：ElectronicdevicessuchasDisplayModule(LCD,LED,OLEDTV,MONITOR)、Computer、MOBILE)WaytoUseTFGisanewconceptofthegasket.Asbelowpictures,itcanbeeffectivelythermalconductivityevenlocatedinseveraldifferentwayssuchasthesideorthetopside,oragapbetweenheatsieveandheatingelement. Heatsieve :Heatsink,MetallicBACKCOVER,metalframeHeatingelement :ICdevices,suchascircuitboardsThisisthemostcommonmethod.Heatsinkattachedtotheside,youcanincreasetheheat.Ifthereisnoverticalspace,Heatsinkcanbeattachedtotheside.TFGisavailabletoheatbygroundingheatsourcebetweenPCBandPCB.(Heatpipe’srole)TFGcanbeheatthroughthePCB.TFGaswellasthetopandsidescanbeappliedtothebottom.ByapplyingtwoTFGcaneffectivelymaximizetheheat.■TestofgasketstateThereisnolimitofthethicknessbyusinghighflatthermalconductivityofgraphite. LaboratoryequipmentModel :ASTMC518Samplesize :28mmX30mmX10mm(T); Graphite400㎛;20%pressureTestmethod1.Itisamethodtotestthermalconductivitytomeasurethevalueofpassingtheheatbyapplyingheattotopandbottomside. 2.Itcalls“Platemethod“. 3.Itispossibletotestthermalconductivityoftopandbottomofsheetsorproducts. 4.Setthetemperatureoftop&bottomside.5.Putthesample.6.Inaddition,measurethermalconductivityafterpressingthepressoftopandbottomside. LaboratoryequipmentModel :HC110(EKOInstruments사)Thermalconductivitytest :0.1~10W/mKTesttemperaturerange :0~110℃Accuracy :Within5%Thermalcontrol :±0.001℃Testsamplesize :51~63mm(Dia.)■comparisontestmethod(ESQ-517-22)»TFGsample,size28(W)x32(L)x10.5(T) »Comparedsample(siliconethermalpad),size(28(W)x32(L)x10.5T)»Heatingplateheatsupto150℃.»AfterattachingTFGsamples,youmeasuresthetimethatthermalsensorwillbefrom40℃to80℃. »Thermalconductivitycomparisontestresults(VSsiliconethermalpad)seethefollowingtable.Testmethod 1.Atestmethodismeasuringthetimeoftemperaturechangeofbottomandtopplate.2.Setthetemperatureofbottomto150℃. 3.Puttheproductonbottomplate,andputitonthetopplatethen,putweightof1KGonthetop. 4.Measuretimeofthetemperaturegaugeofthetopfrom40℃to80℃. 5.Itcanmakerelativecomparison.6.Itisatestmethodtomeasurethetimeofhorizontalorverticalconduction. ThermalconductivitycomparisontestresultsThermalpadDivisionAveragetimetoreachSiliconethermalpad2.3W/mK18’36”3W/mK9’29”5W/mK7’35”TFG-3’11”※TheadvantageofTFGcomparedtotheSiliconethermalpad»Siliconethermalpadusedforalongtimecausesasiloxanebut,TFGdoesn’tcauseit. »Siliconethermalpadthatisnotgoodcompressionresiliencehaspooradhesion.However,TFGcanbeathermaleffectcontinuouslywithexcellentadhesion.»Siliconethermalpadcanbehardenedifusedforalongtime.Itisaprincipalcauseoffailuresuchasbendingofthecircuitboardduetocontinuedpressure.But,TFGhashighelasticitydoesnotputpressureonacircuitboard.»Themoresiliconethermalpadisthicker,themoreheattransfercapabilityisreduced.However,TFGisexcellenthorizontalthermalconductivity(>400W/km)ofgraphitecanbeathermaleffectregardlessofanythickness.ApplicationexampleTestofcomparingtemperatureswhenTFGattachedonTV(“before”and“after”)<Testcondition>› samples :TFG,SideSlitTFG› TV :company’sLEDSmartTV› size :32X28X12(T)[mm]› condition :MeasuringICtemperaturesafterturningonTVduring90minutes(back-coverclosed)<Testresult>SampleICTemp. [℃]IndoorHumidity [%]IndoorTemp[℃]RemarkGeneralTFG46.44320.4Graphite2typesInsulatedgraphitetypeTFG50.94620.9Graphite2types(PETinsulationofgraphiteedge)