SMT EMI SHIELDING GASKET
電洽

| Property | SMF Gasket | SMD type Finger Gasket | Gound Foam gasket |
|---|---|---|---|
| Compression recovery rate | High | Low | High |
| Surface resistance | Low | Low | Middle |
| Gound Contact Part | Face | Dot/Line | Face |
| Eco-friendly | Halogen free | Regulation of BeCu | Halogen free |



(Unit:mm)
| SMF Size | PCB Pattern | Solder Land | Metal Mask Thickness | |||
|---|---|---|---|---|---|---|
| W | L | PW | PL | SW | SG | |
| 4.0 | 3.0 | 4.5 | 3.5 | 1.5 | 1.5 | 0.15 |
| 5.0 | 3.0 | 5.5 | 3.5 | 2.0 | 1.5 | 0.15 |
| 5.0 | 4.0 | 5.5 | 4.5 | 2.0 | 1.5 | 0.15 |
| 8.0 | 8.0 | 8.5 | 8.5 | 3.0 | 2.5 | 0.15 |

| Property | unit | Value | Test Method | |
|---|---|---|---|---|
| Resistance | Bulk | Ω | < 0.1 | ESQ-517-02 |
| After SMT | Ω | < 0.1 | Measure the resistance between gasket and pattern, after passing reflow | |
| After aging test | Ω | < 0.1 | ESQ-517-02 | |
| After salt water spray test | Ω | < 0.1 | ||
| After Thermal shock test | Ω | < 0.1 | TST: Thermal Shock Test | |
| Shielding effectiveness | dB | -70 (Avg.) | MIL DTL-83528C modified | |
| compression recovery rate | Before aging | % | > 90 | ESQ-517-26 |
| After aging | % | > 90 | ESQ-517-18 | |
| Repulsive power | Kgf | < 0.45 | ESQ-517-27 | |
| Plating adhesion | Grade | 5 | ESQ-517-16 | |
| Flame retardant | UL94V-0 | UL94 test | ||

| P/N | D [mm] | T [mm] | Q'ty/reel | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A | B | C | D | E | F | G | H | I | J | OD | ID | RW | ||
| SMF□□-040025-030 | 4 | 2 | 1.5 | 8 | 12 | 5.5 | 1.75 | 4.3 | 0.3 | 2.8 | 330 | 13 | 12.4 | 2,500EA |
| SMF□□-040045-060 | 4 | 2 | 1.5 | 8 | 12 | 5.5 | 1.75 | 6.5 | 0.4 | 4.7 | 330 | 13 | 12.4 | 1,500EA |
| SMF□□-040030-040 | 4 | 2 | 1.5 | 8 | 16 | 7.5 | 1.75 | 5.5 | 0.4 | 3.5 | 330 | 13 | 17.5 | 2,500EA |
