資通國際應材有限公司

產品

GROUND FOAM GASKET

電洽




FABRIC TYPE

Characteristic
Superior shielding effectiveness & compression set

Specification
PropertyUnitMetric Value
Surface resistance Ω/□ < 0.1
Shielding effectiveness (at 100MHz~1GHz) dB > 65
Operating temperature ℃ -20 ~ +80
Recommended compression % 10~15
Flame class - UL94V-0(halogen free)※Only for FRtype
Enviromentally-friendly - RoHS Compliant

Shielding effectiveness

・Test standard : Advantest [MIL DTL-83528C equivalent]
・Sample size : 10mm(W) x 5mm(T), double sided PSA(T222)
・Surface material : conductive fabric (Polyester + Cu, Ni)

Compression-deflection-resistance test

・Test standard : ESQ-517-27 (referred to various test method)
・Sample : SF100100R-M-NC-A
・Sample size : 10mm(W) x 10mm(T) x 50mm(L)
・Recommended compression : Approx. 30%

Processing into other various shapes and dimension are possible



Electricity is conducted through the outer conductive layer of the gasket from A to B. Use of conductive PSA increases the electrical contact area between the gasket's outer layer and B at a slight sacrefice of PSA's adhesive strenth and cost over non- conductive PSA. When the width of the gasket is narrow, conductive PSA is required.

Gasket Structure Guidelines
Required conditionCladdingCore: PU foam
[hardness(ILD25%):45Kg/314㎤]		PSA width vs. (Gasket width) [%]
Double sided conductive PSADouble sided non-conductive PSA
High shielding effectiveness with strong adhesion AU plated type PU foam 30 -
Primarily shielding effectiveness Cu,Ni plated type PU foam 50 -
Primarily adhesion strength Cu,Ni plated type PU foam 30 50
High pressure Cu,Ni plated type PU foam (specified hardness)
(ex: 70Kg/314㎤)		 - 30
Low price Al foil PU foam - 30
Please note that above chart is just recommendation, so user make a decision according to application & condition


the fabric over foam is grounding between inner communication equipment case and I/O connector of PCB


the fabric over foam is grounding between inner frame (or tuner) and outer chassis


the fabric over foam is grounding between outer case of cell phone and inner conductive coating